Description Ready to shape the future of quantum computing? At Diraq, we’re scaling millions of qubits on a single chip using silicon CMOS—unlocking practical, commercial quantum applications. This is a company with a genuine pathway to commercial quantum computing, not just theoretical promise. We’re building what could become the most exciting technology the world has ever seen—and we’re doing it with the speed, scale, and ambition of a future trillion-dollar company, in a space where billion-dollar valuations are already the norm. Diraq is a global business with teams located in Sydney, Australia, and Palo Alto, Boston, LA and Chicago United States. Our presence across these key locations enables us to access top-tier talent and collaborate closely with leading research institutions, government agencies, and commercial partners. The Lead Packaging Engineer is responsible for the end‑to‑end architecture, development, and delivery of advanced packaging solutions for Diraq’s silicon‑based quantum processors. This role plays a critical leadership position in defining packaging strategies that enable scalable, high‑performance quantum systems, balancing electrical performance, thermal management, mechanical integrity, and manufacturability. Working at the intersection of device engineering, system architecture, and semiconductor manufacturing, the Lead Packaging Engineer collaborates closely with internal engineering teams and external industry partners to co‑develop and deploy state‑of‑the‑art packaging technologies that support Diraq’s roadmap from R&D through to scaled production. Requirements Bachelor’s degree (or higher) in Mechanical Engineering, Electrical Engineering, Materials Science, or a related field Significant industry experience in advanced semiconductor packaging for high‑performance or deep‑tech hardware Demonstrated expertise in: PCB and/or substrate design for high‑density electronics Mechanical design for semiconductor assemblies Failure analysis, reliability testing, and qualification processes Strong understanding of thermal management and mechanical reliability in complex electronic systems Proven track record of delivering robust, scalable hardware solutions from concept through manufacturing Experience working across cross‑disciplinary engineering teams and with external manufacturing partners Ability to operate effectively in a fast‑moving R&D environment with evolving technical requirements Preferred / Nice‑to‑Have Experience Experience with cryogenic electronics or quantum, superconducting, or ultra‑low‑temperature systems Experience supporting technology transfer from R&D into pilot or volume manufacturing Exposure to semiconductor foundry or OSAT environments Prior technical leadership or mentoring responsibilities
